Apparatus and a method for conditioning a semiconductor wafer po

Details Apparatus and a method for conditioning a semiconductor wafer po Apparatus and a method for conditioning a semiconductor wafer po

1998-01-20

2000-10-31

Banks, Derris H.

Abrading

Abrading process

With tool treating or forming

451444, 451443, B24B 100

Patent

active

061394041

ABSTRACT:
A semiconductor wafer polishing pad conditioner which includes a support structure and a roller which is rotatably mounted to the support structure. The roller has a working surface which is formed with a plurality of blades.

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