Apertured ring for exhausting plasma reactor gases

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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118 501, 118620, 118728, 156643, 156646, 204298, B44C 122, C23C 1400

Patent

active

048203718

ABSTRACT:
An annular ring (38) adapted for use in a plasma reaction chamber. The annular ring (38) includes a central opening aperture for laterally retaining a semiconductor slice (40) within the chamber. Spaced around the ring are a plurality of gas exhaust ports (58) for providing a back pressure within the chamber, for removing gases therefrom. Different rings can be provided with different central opening apertures to accommodate the processing of different sized slices. Alternative arrangements of the ring (38) provide for mask openings (68) to mask selected areas of the slice (40) and prevent plasma reactions thereat.

REFERENCES:
patent: 4209357 (1980-06-01), Gorin et al.
patent: 4534816 (1985-08-01), Chen et al.
patent: 4579618 (1986-04-01), Celestino et al.
patent: 4590042 (1986-05-01), Drage

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