Apertured electronic circuit package

Details Apertured electronic circuit package Apertured electronic circuit package

1981-04-03

1984-03-27

Envall, Jr., Roy N.

Electrical resistors

With mounting or supporting means

Plural resistors

219121CH, 219121LJ, 29610R, 174 52FP, H01C 101

Patent

active

044397542

ABSTRACT:
An electronic circuit package in which a resistor network is readily installed and remains accessible for laser trimming after final assembly of the package. A substrate is provided having a circuit pattern on a surface thereof and terminating in electrical terminals for connection to external circuitry. The substrate includes an aperture about the periphery of which a plurality of contact pads are arranged and in connection with intended paths of the circuit pattern. A resistor network is formed on a surface of a smaller substrate, the resistors being connected to contact pads disposed about the periphery of the smaller substrate and configured to be in alignment with respective pads at the aperture of the larger substrate. The smaller substrate is placed on the larger substrate with the respective contact pads in alignment, and the engaged contact areas are bonded to mechanically retain the smaller substrate and to electrically interconnect the resistor network with the associated circuit pattern. The network remains accessible by way of the aperture in the larger substrate such that resistors can be laser trimmed after final assembly of the circuit package to achieve an intended and precise specification. After trimming, the network can be protected by an appropriate encapsulating layer.

REFERENCES:
patent: 3634600 (1972-01-01), Griffin et al.
patent: 3699642 (1972-10-01), McWilliams
patent: 3768157 (1973-10-01), Buie
patent: 3984620 (1976-10-01), Robillard et al.

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