Aperture sealing device for film lead fabrication

Details Aperture sealing device for film lead fabrication Aperture sealing device for film lead fabrication

1975-12-12

1977-03-01

McIntosh, John P.

Coating apparatus

Solid applicator contacting work

Pads or absorbent or porous applicators

B05C 106

Patent

active

040096831

ABSTRACT:
A positive pressure apparatus for depositing a thin, even layer of an adhering liquid material to seal openings on a metallic clad film-type carrier is disclosed. The openings, on the film side opposite the metallic lamination, are covered prior to the etching process in order to minimize undercutting by the etching material on the metallic lamination and to provide support for the resulting integrated circuit leads. The apparatus uses a positive pressure mechanism to force the fluid material through a porous ceramic element in order to obtain uniform flow.

REFERENCES:
patent: 1296107 (1919-03-01), Oakley
patent: 1937006 (1933-11-01), Aronson
patent: 1957545 (1934-05-01), Krueger et al.
patent: 2666416 (1954-01-01), Rickmeyer
patent: 3152011 (1964-10-01), Gerard
patent: 3420208 (1969-01-01), Guthrie
patent: 3467478 (1969-09-01), Webber

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