Antistatic socket apparatus

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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439 70, 439 73, H01R 909

Patent

active

056203276

ABSTRACT:
Electrical connection between a measurement instrument and a semiconductor device having internal elements sealed in a non-conductive package, is established by way of leads which protrude out of the semiconductor device, when it is mounted on an antistatic socket apparatus. The socket apparatus has a bearer which is made of a non-conductive material that has a resistance selected to permit diffusion of static charges but which otherwise maintains adequate electrical insulation properties. Protrusions on a mounting surface of the socket support the package through contact surfaces which have a total area smaller than that of the mounting surface of the bearer and which reduce the static charge generating frictional contact between the package and the socket apparatus.

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patent: 4595794 (1986-06-01), Wasserman
patent: 4684184 (1987-08-01), Grabbe et al.
patent: 5100332 (1992-03-01), Egawa
patent: 5249971 (1993-10-01), Lai et al.
patent: 5395255 (1995-03-01), Kato
patent: 5395260 (1995-03-01), Hayakawa et al.

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