Radiation imagery chemistry: process – composition – or product th – Thermographic process – Heat applied after imaging
Reexamination Certificate
2006-12-05
2006-12-05
Chea, Thorl (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Thermographic process
Heat applied after imaging
C430S523000, C430S510000, C430S517000, C430S530000, C430S531000, C430S533000, C430S534000, C430S535000, C430S536000, C430S619000
Reexamination Certificate
active
07144689
ABSTRACT:
The use of metal antimonates at high metal antimonate to binder ratios in buried backside conductive layers of thermographic and photothermographic materials allows the use of thin backside overcoat layers. The combination provides antistatic constructions having excellent antistatic properties that show less change in resistivity with changes in humidity. The thin backside overcoat layer serves to protect the buried antistatic layer.
REFERENCES:
patent: 4418141 (1983-11-01), Kawaguchi et al.
patent: 5310640 (1994-05-01), Markin et al.
patent: 5340676 (1994-08-01), Anderson et al.
patent: 5368995 (1994-11-01), Christian et al.
patent: 5547821 (1996-08-01), Melpolder et al.
patent: 5731119 (1998-03-01), Eichorst et al.
patent: 5827630 (1998-10-01), Eichorst et al.
patent: 5866287 (1999-02-01), Christian et al.
patent: 6342343 (2002-01-01), Toya
patent: 6355405 (2002-03-01), Ludemann et al.
patent: 6436622 (2002-08-01), Geisler
patent: 6464413 (2002-10-01), Oyamada
patent: 6468725 (2002-10-01), Takamuki
patent: 6479227 (2002-11-01), Kubo et al.
patent: 6689546 (2004-02-01), LaBelle et al.
patent: 2001/0055490 (2001-12-01), Oyamada
patent: 2006/0046932 (2006-03-01), Ludemann et al.
patent: 7(1995)-295146 (1995-11-01), None
JP Abstract 2003-029378.
Bhave Aparna V.
Koestner Roland J.
LaBelle Gary E.
Ludemann Thomas J.
Philip Darlene F.
Chea Thorl
Eastman Kodak Company
Leichter Louis M.
Tucker J. Lanny
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