Patent
1986-06-26
1988-01-19
Edlow, Martin H.
357 73, 357 61, H01L 2330, H01L 2306
Patent
active
047207418
ABSTRACT:
In an electronic device assembly comprising at least one circuit element an encapsulant therefor, wherein the encapsulant comprises a silicone resin characterized in that subsequent to the curing of said encapsulant, the resin is coated with a fine inorganic powder such as fumed or fused silica which essentially eliminates static charge and tackiness of the surface.
REFERENCES:
patent: 3206647 (1965-09-01), Kahn
patent: 3325586 (1967-06-01), Suddick
patent: 3496427 (1970-02-01), Lee
Schaaf Theodore F.
Wong Ching-Ping
American Telephone and Telegraph Company, AT&T Technologies, Inc
Anderson Roderick B.
Clark S. V.
Edlow Martin H.
Spivak Joel F.
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