Compositions – Electrically conductive or emissive compositions – Metal compound containing
Reexamination Certificate
2011-03-15
2011-03-15
Kopec, Mark (Department: 1766)
Compositions
Electrically conductive or emissive compositions
Metal compound containing
C174S066000, C174S092000, C252S512000, C252S513000, C252S514000, C210S490000
Reexamination Certificate
active
07906046
ABSTRACT:
A joint compound for electrical connections is disclosed which includes an antioxidant base material and a quantity of stainless steel grit mixed with the antioxidant base material to provide improved mechanical pullout strength. The joint compound has a weight ratio of antioxidant to stainless steel grit in the range of from about 30:70 to about 90:10, preferably, from about 40:60 to about 70:30, and more preferably about 50:50. The stainless steel grit is cut wire having a diameter within the range of from about 0.012 inches to about 0.125 inches, with a preferred diameter within the range of from about 0.012 inches to about 0.030 inches, and 0.017 inches being a more preferred stainless steel grit diameter.
REFERENCES:
patent: 2815497 (1957-12-01), Redslob
patent: 2818346 (1957-12-01), Gossman
patent: 2869103 (1959-01-01), Wells
patent: 2901722 (1959-08-01), Arnott, Jr.
patent: 2906987 (1959-09-01), Fox, Jr.
patent: 2951110 (1960-08-01), Matthysse et al.
patent: 3157735 (1964-11-01), Stroup et al.
patent: 3275738 (1966-09-01), Flynn et al.
patent: 3833513 (1974-09-01), Fath
patent: 3895851 (1975-07-01), Bolton et al.
patent: 3916517 (1975-11-01), Luongo
patent: 4214121 (1980-07-01), Charneski et al.
patent: 4312793 (1982-01-01), Charneski et al.
patent: 4596670 (1986-06-01), Liu
patent: 4784707 (1988-11-01), Wefers et al.
patent: 5090923 (1992-02-01), Kenyon et al.
patent: 5326636 (1994-07-01), Durand et al.
patent: 6479763 (2002-11-01), Igaki et al.
patent: 6533963 (2003-03-01), Schleifstein et al.
patent: 6733308 (2004-05-01), Jedlitschka
patent: 6942529 (2005-09-01), Fujimoto et al.
patent: 2002/0074282 (2002-06-01), Herrmann et al.
Haczynski Christopher R.
Sokol Robert L.
Clancy Christopher S.
Kopec Mark
McCann Robert A.
Nguyen Khanh Tuan
Panduit Corp.
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