Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1975-06-02
1980-02-12
Hess, Bruce H.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
29576R, 29577R, 29590, 148 615R, 148 62, 427 89, 427 96, 428901, B32B 310, H01L 2102, H01L 2160
Patent
active
041884388
ABSTRACT:
Copper parts associated with thermal compression bonding of lead structures to a semiconductive device, such as the lead frame, the interconnect lead, and the gang bonding bumps, are coated with an antioxidant material. The antioxidant material and its thickness are chosen to be compatible with thermal compression bonding therethrough so that the completed thermal compression bond forms a bonding interface to the copper through the antioxidant coating. Suitable antioxidant coating materials include, gold, chromate, and copper phosphate.
REFERENCES:
patent: 1927671 (1933-09-01), Shiraishi
patent: 2628925 (1953-02-01), Ostrander
patent: 3162512 (1964-12-01), Robinson
patent: 3214292 (1965-10-01), Edson
patent: 3480841 (1969-11-01), Castrucci et al.
patent: 3764399 (1973-10-01), Caule
patent: 3764400 (1973-10-01), Caule
patent: 4000842 (1977-01-01), Burns
patent: 4005472 (1977-01-01), Harris et al.
patent: 4042954 (1977-08-01), Harris
Hess Bruce H.
National Semiconductor Corporation
Woodward Gail W.
LandOfFree
Antioxidant coating of copper parts for thermal compression gang does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Antioxidant coating of copper parts for thermal compression gang, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Antioxidant coating of copper parts for thermal compression gang will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1855366