Antifuse with improved on-state reliability

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to conductive state

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438467, 438600, H01L 2182

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active

060339381

ABSTRACT:
Treatment of the positive electrode interface of an antifuse provides significantly improved on-state reliability. Treatments include, but are not limited to, a plasma etch using carbon tetrafluoride (CF.sub.4), a sputter clean using Argon, and wet chemical treatments using dimethyl formamide (and water) or a resist developer.

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Ali Iranmanesh, Yakov Karpovich, Sukyoon Yoon, "Antifuse Reliability and Link Formation Models", pp. 90-94, IEEE 1994 International Integrated Reliability Workshop Final Report, sponsored by IEEE Electron Devices Society and the IEEE Reliability Society, 1994.
Robert F. Pierret, "Ohmic Contacts", Semiconductor Device Fundamentals, School of Electrical and Computer Engineering, Purdue University, 1996, pp. 498-500.

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