Antifuse structures with improved manufacturability

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

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Details

257751, H01L 2900, H01L 2348, H01L 2352, H01L 2940

Patent

active

058313257

ABSTRACT:
An antifuse structure of the present invention comprises an antifuse layer and a bottom electrode which are immune to the damages caused by harmful processing environment. The three major components of the antifuse--the bottom electrode, the antifuse layer and the top buffer layer--are formed consecutively without any photolithography or etching step in-between. The top buffer layer is defined before the bottom electrode. This antifuse structure can substantially improve the antifuse manufacturability.

REFERENCES:
patent: 4899205 (1990-02-01), Hamdy et al.
patent: 4914055 (1990-04-01), Gordon et al.
patent: 4937650 (1990-06-01), Shinriki et al.
patent: 5070384 (1991-12-01), McCollum et al.
patent: 5100827 (1992-03-01), Lytle
patent: 5196724 (1993-03-01), Gordon et al.
patent: 5266829 (1993-11-01), Hamdy et al.
patent: 5373169 (1994-12-01), McCollum et al.
patent: 5374832 (1994-12-01), Tung et al.
patent: 5412244 (1995-05-01), Hamdy et al.
patent: 5482884 (1996-01-01), McCollum et al.
patent: 5485031 (1996-01-01), Zhang et al.
patent: 5521423 (1996-05-01), Shinriki et al.
patent: 5552627 (1996-09-01), McCollum et al.
patent: 5572409 (1996-11-01), Nathan et al.
patent: 5592016 (1997-01-01), Go et al.
Lachenbruch et al. "Contamination study of plasma etching", Semiconductor International, vol. 8, No. 5, pp. 164-168, May 1985.
Handbook of Plasma Processing Technology--Fundamentals, Etching, Deposition and Surface Interaction, pp. 215-217, 1990.
Awadelkarim et al. "Silicon Micromachining and its impact on materials and device properties: plasma-etching damage issues", Proceedings of SPIE, vol. 2448, pp. 130-140, 1995.
Aoki et al. "Direct analysis of contamination in submicron contact holes by thermal desorption spectroscopy", Journal of Vacuum Science and Technology A, vol. 13, No. 1, pp. 42-46, Jan.-Feb. 1995.
DeJule, "Managing etch and implant residue", Semiconductor International, vol. 20, No. 9, pp. 56-64, Aug. 1997.

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