Antifuse elements

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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Details

C257SE21625, C257SE23147, C257SE29133, C257SE29137, C257SE29266, C438S165000, C438S981000

Reexamination Certificate

active

07834417

ABSTRACT:
An antifuse element (102, 152, 252, 302, 352, 402, 602, 652, 702) includes a substrate material (101) having an active area (106) formed in an upper surface, a gate electrode (104) having at least a portion positioned above the active area (106), and a gate oxide layer (110) disposed between the gate electrode (104) and the active area (106). The gate oxide layer (110) includes one of a gate oxide dip (128) or a gate oxide undercut (614). During operation a voltage applied between the gate electrode (104) and the active area (106) creates a current path through the gate oxide layer (110) and a rupture of the gate oxide layer (110) in a rupture region (130). The rupture region (130) is defined by the oxide structure and the gate oxide dip (128) or the gate oxide undercut (614).

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