Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent
1994-12-05
1997-06-24
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
257 50, 257 52, 257209, 257528, H01L 2904, H01L 2710, H01L 2900
Patent
active
056419856
ABSTRACT:
Antifuse elements for a semiconductor device comprise a bottom electrode, a top electrode, and an antifuse material layer. The bottom electrode is formed of a conductive material having an amorphous structure. The conductive material contains such elements as W, Ti, or a compound thereof. Since there is no grain boundary on the surface of the bottom electrode having an amorphous structure, any sharp protrusions are diminished to promote the smoothness. The antifuse material film is mounted on the surface of the bottom electrode. The bottom electrode contains such elements having an excellent EM resistance as W, Mo. These elements are also to be contained in a filament which is formed after programming.
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Babcock et al., "Ti-W Contacts to Si", J. Appl. Phys. 53(10), American Institute of Physics, Oct. 1982, pp. 6898-6905.
Y.K. Fang et al. "Observations on the phase transformation and its effect on the resistivity of WSi.sub.2 films prepared by low-pressure chemical vapor deposition," J. Appl. Phys. 57(8), 15 Apr. 1985, pp. 2980-2982.
N. Matsukawa et al., "New Models for Sheet Resistance Increase of Titanium Silicide Layers Formed on As Ion Implanted Si Substrates," Jun. 7-8, 1994 VMIC Conference, pp. 475-477.
Ohta Tomohiro
Shinriki Hiroshi
Tamura Yoshimitsu
Kawasaki Steel Corporation
Martin Wallace Valencia
Saadat Mahshid D.
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