Antifuse circuit with improved gate oxide reliability

Miscellaneous active electrical nonlinear devices – circuits – and – Specific identifiable device – circuit – or system – Fusible link or intentional destruct circuit

Reexamination Certificate

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Details

C327S534000

Reexamination Certificate

active

06724238

ABSTRACT:

BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates generally to antifuse circuits in integrated circuit devices. More specifically, the present invention relates to methods and apparatus for improving the gate oxide reliability in an antifuse latch circuit.
Antifuse latch circuits may be included in integrated circuit memory devices as part of an address detection circuit. Address detection circuits monitor the row and column addresses of integrated memory cell arrays and enable a redundant row or column within the array when the address of a defective row or column is received. U.S. Pat. No. 5,631,862 to Cutter et al., assigned to the assignee of the present invention and incorporated by reference herein in its entirety, discloses an antifuse bank address detection circuit that includes a bank of self-decoupling antifuse circuits.
For purposes of discussion, an exemplary self-decoupling antifuse latch circuit
10
is shown in FIG.
1
. In a program mode, anti fuse latch circuit
10
may be programmed to blow antifuse
28
. In a normal operation mode, latch output signal FA may be read to determine whether antifuse
28
has been blown or not. For example, latch output signal FA will be a logic high when antifuse
28
is blown and latch output signal FA will be a logic low when antifuse
28
is not blown.
Antifuse latch circuit
10
includes an output latch
12
and a latch control section
14
. Output latch
12
includes three PMOS transistors
16
,
18
,
20
, an inverter
22
, and two NMOS transistors
24
,
26
. PMOS transistors
18
,
20
are coupled in parallel with their sources coupled to the drain of PMOS transistor
16
and their drains coupled to the input of inverter
22
. The gate of PMOS transistor
18
is coupled to signal RDFUS and the gate of PMOS transistor
20
is coupled to the output of inverter
22
. The source of PMOS transistor
16
is coupled to voltage V
CC
and its gate is coupled to signal MRG. NMOS transistors
24
,
26
are coupled in series between the drains of PMOS transistors
18
,
20
and ground. The gate of NMOS transistor
24
is coupled to signal RDFUS and the gate of NMOS transistor
26
is coupled to the output of inverter
22
. The output of inverter
22
is the latch output signal FA.
Latch control section
14
includes three NMOS transistors
30
,
32
,
34
and an antifuse
28
. Antifuse
28
is coupled between signal CGND and the drain of NMOS drop transistor
30
. As used herein, NMOS drop transistor
30
is also known as the “protection device.” The gate of protection device
30
is coupled to voltage V
CCP
through protection device gate input
36
and its source is coupled to the drain of NMOS transistor
32
at control node
38
. The gate of NMOS transistor
32
is coupled to the fuse selection signal FS and its source is coupled to signal BSEL. NMOS transistor
34
is coupled between control node
38
and the input of inverter
22
in the output latch
12
. The gate of NMOS transistor
34
is coupled to signal DVC
2
F, which is typically V
CC
/2+NMOS threshold voltage, V
t
. Signal DVC
2
F may be used to limit the amount of voltage across the dielectric of unblown antifuses so that the antifuse dielectric does not receive a higher voltage stress across it that than the memory cells in the memory array. For example, if DVC
2
F=V
CC
/2+NMOS Vt, then the maximum voltage across an unblown antifuse will be V
CC
/2, which is what the cell plate of the array is typically set to.
Unblown antifuse
28
forms an open circuit. To blow antifuse
28
, thus reducing its resistance and allowing current to flow through it, a voltage of approximately+12 Vdc is temporarily placed across its two terminals. This is accomplished by switching signal BSEL to ground, turning on NMOS transistor
32
by ensuring that fuse selection signal FS is a logic high and switching signal CGND to+12 Vdc. Note that protection device
30
does not need to be turned on to complete the path from anti fuse
28
to ground since the gate of protection device
30
is already coupled to voltage V
CCP
. V
CCP
is typically V
CC
+1.4 volts, or V
CC
+the threshold voltage, V
t
, of the access device+an additional voltage margin to cover process variation. While in this program mode, protection device
30
limits the maximum voltage applied to control node
38
to the voltage V
CCP
minus the threshold voltage V
T
of protection device
30
. Thus, protection device
30
limits the drain-to-gate voltage of NMOS transistor
32
and the source-to-gate voltage of NMOS transistor
34
to limit the breakdown of the gate oxide and improve reliability. However, when antifuse
28
is blown, a large voltage stress is placed across the gate oxide of protection device
30
. This high voltage stress can cause pinholes in the gate oxide of protection device
30
during the burn-in stress portion of the manufacturing process and can reduce the reliability of the antifuse latch circuit
10
during normal operation.
Thus, it would be advantageous to develop a technique and device for reducing or removing the high voltage stress placed across the gate oxide of the protection device
30
once the antifuse
28
has been blown and during normal operation of an antiflise latch circuit.
BRIEF SUMMARY OF THE INVENTION
The present invention relates to methods and apparatus for improving the gate oxide reliability in an antifuse latch circuit.
An antifuse latch circuit with improved gate oxide reliability according to the present invention includes a voltage converter circuit configured to selectively alter the voltage level applied to the gate input of a protection device of the antifuse latch circuit upon receiving a signal. In one embodiment of the invention, the voltage converter is configured to selectively reduce or increase the voltage level of a single signal to be applied to the protection device gate input. In another embodiment of the invention, the voltage converter is configured to selectively switch the protection device gate input between at least two voltage levels.
In yet another embodiment of the invention, the voltage converter circuit comprises a cascade voltage switch logic circuit coupled to the gates of two PMOS transistors. Each PMOS transistor is coupled between the protection device gate input and a separate and distinct voltage level. The cascade voltage logic circuit is configured to selectively switch the protection device gate input between the two voltage levels coupled to the two PMOS transistors.
A method of improving the gate oxide reliability in an antifuse latch circuit according to the present invention comprises applying a signal at a first voltage level to the gate of a protection device of an antifuse latch circuit during the programming of the antifuse and applying the signal at a second voltage level to the gate of the protection device during the reading of the antifuse and during normal operation.


REFERENCES:
patent: 4823181 (1989-04-01), Mohsen et al.
patent: 5163180 (1992-11-01), Eltoukhy et al.
patent: 5258643 (1993-11-01), Cohen
patent: 5395797 (1995-03-01), Chen et al.
patent: 5399920 (1995-03-01), Van Tran
patent: 5461333 (1995-10-01), Condon et al.
patent: 5631862 (1997-05-01), Cutter et al.
patent: 6016264 (2000-01-01), Lin
patent: 6333666 (2001-12-01), Kim et al.
patent: 6344766 (2002-02-01), Mihara et al.
patent: 6400632 (2002-06-01), Tanizaki et al.
patent: 6525983 (2003-02-01), Wilkins

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