Anti-skew mounting pads and processing method for electronic sur

Details Anti-skew mounting pads and processing method for electronic sur Anti-skew mounting pads and processing method for electronic sur

1995-09-14

1997-09-02

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 29832, 29834, 29840, 361767, H05K 102

Patent

active

056635290

ABSTRACT:
A footprint, and method for forming the footprint, of the type for mounting a surface mount component having a heatsink which defines a first registration edge thereon. The substrate pad is positioned on the substrate for registrated engagement with the heatsink. The substrate pad has an area substantially larger than the area of the heatsink to improve the dissipation of thermal energy. The substrate pad includes notches for defining registration edges which are juxtaposed with corresponding registration edges on the heatsink when the electronic component is in proper alignment with the substrate pad. Surface tension forces produced by melting solder interposed between the heatsink and the substrate pad act upon the registration edges to maintain proper alignment of the component with the substrate pad.

REFERENCES:
patent: 3842190 (1974-10-01), Towell
patent: 3964087 (1976-06-01), Mallon
patent: 4883920 (1989-11-01), Tanabe et al.
patent: 5266747 (1993-11-01), Gheorghiu et al.
patent: 5303122 (1994-04-01), Adams, Jr. et al.
patent: 5311405 (1994-05-01), Tribbey et al.
patent: 5357060 (1994-10-01), Yamashita
patent: 5362927 (1994-11-01), Ezaki
patent: 5453528 (1995-09-01), Amano et al.
"Surface Mount Footprint Improvement", IBM Technical Disclosure Bulletin, vol. 31, No. 3, Aug. 1988, p. 408.

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