Anti-short bonding pad structure

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 68, 357 54, 357 55, H01L 2348, H01L 2946, H01L 2934, H01L 2906

Patent

active

045395829

ABSTRACT:
A semiconductor device comprising a semiconductor substrate, a first insulating layer formed on the semiconductor substrate, a bonding pad formed on the first insulating layer, a conductive layer formed on the first insulating layer and adjacent to the bonding pad, and a second insulating layer formed to cover the conductive layer characterized in that the surface of the second insulating layer formed on and near the conductive layer is made at the same level as or lower than the surface of the bonding pad.

REFERENCES:
patent: 3717567 (1973-02-01), Bhatt
patent: 3721838 (1973-03-01), Brickman et al.
patent: 3942187 (1976-03-01), Gelsing et al.
patent: 4060828 (1977-11-01), Satonaka
patent: 4198648 (1980-04-01), Nishizawa
patent: 4228447 (1980-10-01), Sato et al.
patent: 4259678 (1981-03-01), van Gorkom et al.
patent: 4270262 (1981-06-01), Hori et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Anti-short bonding pad structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Anti-short bonding pad structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Anti-short bonding pad structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-616544

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.