Anti-shear method and system for semiconductor wafer removal

Details Anti-shear method and system for semiconductor wafer removal Anti-shear method and system for semiconductor wafer removal

1996-05-30

1998-06-23

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

156345, 216 88, H01L 2100

Patent

active

057705216

ABSTRACT:
A method and system for removing an 8-inch semiconductor wafer from a final polishing pad of a Chemical Mechanical Polishing machine is disclosed. The polishing machine includes a rotating platen, and a polishing pad affixed thereto for rotation therewith. Moreover, the machine includes a generally-cylindrical carrier portion rotatable about an axis of rotation for receiving and retaining the semiconductor wafer. During normal operation, the platen and carrier both rotate about their respective axes of rotation, while, in addition, the carrier is oscillated by a mechanical arm along the surface of the polishing pad in a substantially radial path, relative to the axis of the platen. Prior to removing the wafer, the platen and carrier rotation is discontinued, while the radial movement of the carrier is allowed to continue for predetermined number of oscillations during a predetermined time to thereby dissipate adhesion forces inhibiting removal of the wafer.

REFERENCES:
patent: 5593537 (1997-01-01), Cote et al.

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