Anti-scatter grid and collimator designs, and their motion,...

Details Anti-scatter grid and collimator designs, and their motion,... Anti-scatter grid and collimator designs, and their motion,...

2011-04-12

2011-04-12

Culbert, Roberts (Department: 1716)

Etching a substrate: processes

Adhesive or autogenous bonding of two or more...

Removing at least one of the self-sustaining preforms or a...

C216S012000, C216S024000

Reexamination Certificate

active

07922923

ABSTRACT:
Grids and collimators, for use with electromagnetic energy emitting devices, include at least a metal layer that is formed, for example, by electroplating/electroforming or casting. The metal layer includes top and bottom surfaces, and a plurality of solid integrated walls. Each of the solid integrated walls extends from the top to bottom surface and has a plurality of side surfaces. The side surfaces of the solid integrated walls are arranged to define a plurality of openings extending entirely through the layer. At least some of the walls also can include projections extending into the respective openings formed by the walls. The projections can be of various shapes and sizes, and are arranged so that a total amount of wall material intersected by a line propagating in a direction along an edge of the grid is substantially the same as another total amount of wall material intersected by another line propagating in another direction substantially parallel to the edge of the grid at any distance from the edge. Methods to fabricate these grids using copper, lead, nickel, gold, any other electroplating/electroforming materials, metal composites or low melting temperature metals are described.

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