Anti-rotation ground clip for faceplates

Details Anti-rotation ground clip for faceplates Anti-rotation ground clip for faceplates

1999-11-23

2001-07-31

Sircus, Brian (Department: 2839)

Electrical connectors

With circuit conductors and safety grounding provision

C439S108000

Reexamination Certificate

active

06267607

ABSTRACT:

FIELD OF THE INVENTION
The invention relates generally to electrostatic discharge devices for telecommunications equipment.
BACKGROUND OF THE INVENTION
A telecommunications eletrostatic discharge (ESD) requirement states that there should be no floating metal on a circuit pack. Floating metal acts as an antenna during an ESD discharge event. In addition, a floating piece of metal may contribute to a more severe secondary discharge. Floating metal can also be an electrical safety hazard. Therefore, a metal panel (faceplate) attached to a circuit pack must be grounded to earth when inserted into a subrack. The grounded faceplate also provides a path to ground from the ground layer of the circuit board.
FIG.
1
. shows a conventional face plate assembly having a ground clip
12
that provides a ground path from the faceplate assembly to the subrack frame ground. The ground clip
12
is riveted to a metal face plate
60
attached to a circuit pack
80
. A single rivet
13
secures the first end or base
14
of the ground clip to the face plate
60
, while the opposite or free end
15
of the ground clip
12
is free to rotate about the axis of the rivet
13
. The ground clip
12
includes a contact surface
16
that is offset from an axis of the rivet
13
. The contact surface
16
is compliant in that it deflects downward as the circuit pack
80
is inserted in the subrack. Forces imparted on the contact surface
16
during insertion and extraction of the circuit pack
80
from the subrack
16
can cause the ground clip
12
to rotate or become skewed with respect to the face plate
60
. If the ground clip becomes misaligned it can snag adjacent components, impairing the operability of the system.
Accordingly, improved apparatus and methods for grounding the face plates of circuit packs are desirable.
SUMMARY OF THE INVENTION
The invention provides a face plate assembly including a ground clip that is mounted to a face plate which is coupled to a circuit pack. The ground clip includes a base member, a contact surface and a free end. The ground clip is mounted to a flange provided on the faceplate. The flange includes a cutout, wherein the free end of the ground clip is received in the cutout for preventing rotation of the ground clip.


REFERENCES:
patent: 5452184 (1995-09-01), Scholder et al.
patent: 5513996 (1996-05-01), Annerino et al.
patent: 5647748 (1997-07-01), Mills et al.
patent: 6017226 (2000-01-01), Jeffries et al.
patent: 6074251 (2000-06-01), Edgerly et al.
patent: 6089882 (2000-07-01), Costello

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