Anti-fuse and method for writing information into the anti-fuse

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257S050000

Reexamination Certificate

active

06870240

ABSTRACT:
The anti-fuse comprises a substitutable layer14, an interconnection layer20connected to the substitutable layer, and the interconnection layer contains metal atoms which can be substituted with constituent atoms of the substitutable layer. The anti-fuse can be changed from the non-conduction state to the conduction state at a relatively low temperature of 300° C. to 600° C., and by application of not so intense laser beams, the anti-fuse can be changed from the non-conduction state to the conduction state. The anti-fuse can be changed from the non-conduction state to the conduction state by using an inexpensive equipment, which can realize decrease of fabrication costs and accordingly inexpensive semiconductor devices can be provided.

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Hiroshi Horie et al.,Novel High Aspect Ratio Aluminum Plug for Logic/DRAM LSIs Using Polysilicon-Aluminum Substitute(PAS), International Electron Device Meeting 96; pp. 946-948 (1996).
S. Nakamura et al.;Aluminum Word Line and Bit Line Fabrication Technology for COB DRAM Using a Polysilicon-Aluminum Substitute, 1999 Symposium on VLSI Technology Digest of Technical Papers, 4A-2, pp. 35-36, (1999).

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