Anti-bridging pads for printed circuit boards and interconnectin

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

361767, 361777, 2281801, H05K 102

Patent

active

056799292

ABSTRACT:
The present invention provides anti-bridging pad(s) for wave soldering of interconnecting substrates. In particular, the present invention provides interconnecting substrates (e.g. printed circuit board) having anti-bridging pad(s) which substantially conform to trailing pad(s), have geometries and/or placements with respect to trailing pad(s) in an array of functional pads which reduce or eliminate solder bridging.

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