Communications: radio wave antennas – Antennas – Microstrip
Patent
1999-04-30
2000-11-28
Wong, Don
Communications: radio wave antennas
Antennas
Microstrip
343846, 343853, H01Q 138
Patent
active
061541761
ABSTRACT:
An array antenna includes a first ceramic layer and a second ceramic layer. A metal layer is disposed between the first and second ceramic layers. A plurality of radiating elements are mounted on the first ceramic layer, and a plurality of control circuits are mounted on the second ceramic layer. The control circuits are coupled to the radiating elements through a plurality of conductive vias which feed through the metal layer. The array antenna may also include a switch having a plurality of poles formed in the second ceramic layer and coupled to one of the radiating elements through one or more conductive vias. A plurality of phase delay elements may be coupled at a first end to a signal source and coupled at a second end to the respective plurality of poles of the switch to provide phase-delayed signals. A waveguide may also be formed within the ceramic layers. Conductive vias or coaxial transmission lines may be used to connect elements within the array antenna.
REFERENCES:
patent: 5309164 (1994-05-01), Dienes et al.
patent: 5315753 (1994-05-01), Jensen et al.
patent: 5646634 (1997-07-01), Bokhari et al.
patent: 5801660 (1998-09-01), Ohtsuka et al.
patent: 5903239 (1999-05-01), Takahashi et al.
patent: 5977915 (1999-11-01), Bergstedt et al.
patent: 5982256 (1999-11-01), Uchimura et al.
Fathy Aly
Geller Bernard Dov
Perlow Stewart Mark
Rosen Arye
Burke William J.
Nguyen Hoang
Sarnoff Corporation
Wong Don
LandOfFree
Antennas formed using multilayer ceramic substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Antennas formed using multilayer ceramic substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Antennas formed using multilayer ceramic substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1730500