Antenna structure for integrated circuit die using bond wire

Details Antenna structure for integrated circuit die using bond wire Antenna structure for integrated circuit die using bond wire

2007-05-25

2009-08-25

Nguyen, Hoang V (Department: 2821)

Communications: radio wave antennas

Antennas

Balanced doublet - centerfed

C343S803000, C343S818000, C343S820000

Reexamination Certificate

active

07580001

ABSTRACT:
A device20includes a substrate22having an integrated circuit (IC) die24coupled thereto. A bond wire28interconnects a die bond pad32on the IC die24with an insulated bond pad36. Another bond wire38interconnects a die bond pad42on the IC die24with another insulated bond pad46. The bond wires28and38serve as radiating elements of a dipole antenna structure64. A reflector72and director74can be located on the substrate22and/or the IC die24to reflect and/or direct a radiation pattern66emitted by or received by the antenna structure64. A trace82can be interconnected between the insulated bond pads36, 46to form a folded dipole antenna structure84.

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Babakhani, et al., A 77GHz 4-Element Phased Array Receiver With On-Chip Dipole Antennas in Silicon, IEEE International Solid-State Circuits Conference, Session 10, pp. 3-5, 2006.

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