Antenna having elements with improved thermal impedance

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor

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Details

343789, 343853, 343873, 257776, H01L 2941, H01Q 1308, H01Q 2300

Patent

active

057172315

ABSTRACT:
A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active device have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.

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W. S. Wong, et al., "Flip Chip Manufacturing Technology for GaAs MMIC," Hughes Aircraft Company, Microelectronic Circuits Division, 1993 GaAs Mantech, Conf., pp. 224-227.

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