Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
Reexamination Certificate
2006-04-18
2006-04-18
Hassanzadeh, Parviz (Department: 1763)
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching inorganic substrate
C205S214000, C205S220000, C205S223000, C216S103000
Reexamination Certificate
active
07029597
ABSTRACT:
A process for selectively etching a surface of an anodized aluminum article. A preferred process includes: providing an aluminum sheet or web including first and second sides having anodized finishes; etching the first side to improve the adhesion capabilities of that side but not etching the second side so that the second side retains its anodized finish. The anodized aluminum may be colored before etching, thus the second side retains its color after etching. In a more preferred embodiment, sodium hydroxide or phosphoric acid is used to etch the anodized aluminum. Optionally, the etching of the second side is prevented by administering gas or liquid over the second side, masking the second side with a protective film, or shielding the second side with a shield. Further, the gas or liquid administered over the second side may be controlled to increase or decrease the rate of etching on the first side.
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Marczak Gregory S.
Minner Rick A.
Culbert Roberts
Hassanzadeh Parviz
Lorin Industries, Inc.
Warner & Norcross & Judd LLP
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