Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1993-11-08
1995-10-17
Valentine, Donald R.
Chemistry: electrical and wave energy
Apparatus
Electrolytic
204237, 204238, 204277, 204279, 204256, 204258, 204270, 204297R, 204265, C25D 1706, C25D 2100
Patent
active
054587557
ABSTRACT:
An anodization apparatus for anodizing the surface of a semiconductor substrate by supporting the semiconductor substrate between a pair of electrodes in an electrolytic solution and applying a voltage across the pair of electrodes. The anodization apparatus includes an elastic sealing member for supporting a peripheral portion of the semiconductor substrate such that a surface portion of a semiconductor substrate remains exposed, a support jig which includes a tapered hollow portion for supporting the sealing member, and a device for introducing a fluid of gas or liquid into the tapered hollow portion. When the fluid is introduced, the sealing member is pressed against and brought into hermetic contact with the tapered hollow portion and with the entire peripheral portion of the semiconductor substrate such that the electrolytic solution is separated into electrically isolated parts by coordination between the semiconductor substrate, the sealing member, and the support jig. Anodization of the semiconductor substrate may then be carried out, such as by producing a porous silicon layer on the surface of the semiconductor substrate.
REFERENCES:
patent: 2737488 (1956-03-01), Gray
patent: 2801965 (1957-08-01), Monahan
patent: 3536603 (1970-10-01), Bonga
patent: 3720595 (1973-03-01), Kohler
patent: 3835017 (1974-09-01), Mentone et al.
patent: 4430179 (1984-02-01), Ford et al.
patent: 4605483 (1986-08-01), Michaelson
patent: 4849084 (1989-07-01), Vouzellaud
patent: 4898653 (1990-02-01), Morris
Fujiyama Yasutomo
Ishii Mitsuhiro
Kanbe Senju
Kokumai Kazuo
Okita Akira
Canon Kabushiki Kaisha
Valentine Donald R.
LandOfFree
Anodization apparatus with supporting device for substrate to be does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Anodization apparatus with supporting device for substrate to be, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Anodization apparatus with supporting device for substrate to be will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-594097