Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1990-11-21
1992-04-21
Nguyen, Nam
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429806, 20429821, 20429822, 20429823, C23C 1434
Patent
active
051064740
ABSTRACT:
An in-line sputtering system with rotating cylindrical magnetrons is fitted with a system of anodes having a large surface area. The surface area is equal to or greater than the surface area of the sputtering chambers' internal walls. The anodes may be grounded, allowed to float electrically, or connected to a separate bias power supply. The anode surfaces are protected from contamination by sputtered material or are designed so the electron collecting surface may be replaced during the sputtering process. The anodes may be equipped with a magnet array for improving electron collecting efficiency.
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Bjornard Erik J.
Dickey Eric R.
Hoffmann James J.
Nguyen Nam
Viratec Thin Films, Inc.
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