Anode plate for a parallel-plate reactive ion etching reactor

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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156643, 156646, 204298, B44C 122, C03C 2506, C03C 1500

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active

048103225

ABSTRACT:
An anode for a reactive ion etching (RIE) system has a plurality of holes formed therethrough. The holes produce a plasma glow about each hole which results in an increase in the etch rate of wafers to be etched on a cathode opposite the holes. The holes are arranged in the anode to provide a uniform etch rate on one wafer or a batch of wafers to be etched. By varying the pressure in the system, the presence of plasma glow and hence the etch rate uniformity is controlled.

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