Anode design for semiconductor deposition having novel electrica

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204283, 204287, 204280, 204297R, 204224R, 204252, 204263, 204259, 204266, 204278, 118627, 205292, 205295, C25B 1103

Patent

active

061137596

ABSTRACT:
An anode assembly includes a perforated anode and an electrical contact assembly attached to the anode. A perforated anode holder holds the anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through perforations in the anode holder and perforations in the anode. An anode isolator separates the anode and a cathode. The anode isolator includes at least one curvilinear surface. The contact assembly includes a closed or substantially closed cylinder member of titanium or titanium alloy, a copper lining or disk disposed within the cylinder, and a titanium or titanium alloy post fixed and in electrical engagement with the lining or disk.

REFERENCES:
patent: 2689216 (1954-09-01), Nevers et al.
patent: 2923671 (1960-02-01), Van Tilburg
patent: 3300396 (1967-01-01), Walker
patent: 3317410 (1967-05-01), Croll et al.
patent: 3558464 (1971-01-01), Danna
patent: 3652442 (1972-03-01), Powers et al.
patent: 3809642 (1974-05-01), Bond et al.
patent: 3962047 (1976-06-01), Wagner
patent: 4032422 (1977-06-01), Ross et al.
patent: 4233146 (1980-11-01), Rothmayer et al.
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4323438 (1982-04-01), Sesterhenn et al.
patent: 4466864 (1984-08-01), Bacon et al.
patent: 4469564 (1984-09-01), Okinaka et al.
patent: 4569744 (1986-02-01), Walker
patent: 4596637 (1986-06-01), Kozarkek et al.
patent: 4664760 (1987-05-01), Jarrett
patent: 4906341 (1990-03-01), Yamakawa et al.
patent: 4931150 (1990-06-01), Smith
patent: 5000827 (1991-03-01), Schuster et al.
patent: 5023044 (1991-06-01), Negron
patent: 5102521 (1992-04-01), Usuda et al.
patent: 5198083 (1993-03-01), Thornton
patent: 5222310 (1993-06-01), Thompson et al.
patent: 5228966 (1993-07-01), Murata
patent: 5318683 (1994-06-01), Smith et al.
patent: 5377708 (1995-01-01), Bergman et al.
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5429733 (1995-07-01), Ishida
patent: 5431823 (1995-07-01), Gofer
patent: 5435885 (1995-07-01), Jones et al.
patent: 5437777 (1995-08-01), Kishi
patent: 5443707 (1995-08-01), Mori
patent: 5447615 (1995-09-01), Ishida
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5597460 (1997-01-01), Reynolds
patent: 5908540 (1999-06-01), Fanti
patent: 5938899 (1999-08-01), Forand
patent: 6001235 (1999-12-01), Arken et al.
D. Edestein, "Advantages of Copper Interconnectors," Jun. 27-29, 1995, VMIC Conference--1995 ISMIC--104/95/0301.
D. Edestein, et al., "Full Copper Wiring in a Sub-0.25 um CMOSULSI Technology," IEEE IEDM, Washington, D.C. Dec. 7-10 (1997) pp. 301-307.
D. Edelstein, "Integration of Copper Interconnects," ECS 1996.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Anode design for semiconductor deposition having novel electrica does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Anode design for semiconductor deposition having novel electrica, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Anode design for semiconductor deposition having novel electrica will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2208518

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.