Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating process fluid by means other than agitation or...
Reexamination Certificate
1998-11-16
2001-06-26
Gorgos, Kathryn (Department: 1741)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Treating process fluid by means other than agitation or...
C205S097000, C205S123000, C205S292000, C204S285000, C204S283000, C204S287000, C204S280000, C204S297080, C204S22400M, C204S252000, C204S263000, C204S259000, C204S266000, C204S278000
Reexamination Certificate
active
06251251
ABSTRACT:
FIELD OF THE INVENTION
The invention relates to electroplating materials on a substrate. In particular, the invention relates to an anode assembly utilized in electroplating materials on a substrate. The invention also relates to an electroplating system including the anode assembly. Furthermore, the present invention includes a method of electroplating a material on a substrate that includes utilizing the anode assembly and curvilinear or cylindrical diffuser.
BACKGROUND OF THE INVENTION
In the production of microelectronic devices, metal may be plated on a substrate for a variety of purposes. Typically, metal is plated on the substrates in cells or reservoirs that hold a plating solution that includes at least one metal to be plated on the substrate.
Composition of plating baths and conditions within the plating bath must be carefully controlled to produce deposition of a desired quality of desired metal(s) on a substrate. Plating rate, uniformity, and deposit quality may be affected by a variety of factors. For example, among the parameters that may affect rate, uniformity, and deposit quality of plating are concentration of chemicals in the plating bath, nature and distribution of electrical contacts and voltage within the plating system. The physical design of an electroplating system may affect the conditions within the system and the plating carried out in the system.
SUMMARY OF THE INVENTION
The present invention provides an anode assembly that includes a perforated anode. A perforated anode holder holds the anode. The anode holder includes perforations at least at a bottom wall such that plating solution may flow through perforations in the anode holder and perforations in the anode. An anode isolator separates the anode and a cathode. The anode isolator includes at least one curvilinear surface.
The present invention also relates to an electroplating system. The electroplating system includes a plating tank for holding a plating solution including at least one metal to be plated on at least one substrate. A perforated anode holder is arranged within the plating tank for holding an anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through perforations in the anode holder and perforations in the anode. A perforated anode is arranged within the anode holder. An anode isolator separates the anode and a cathode. The anode isolator includes at least one curvilinear surface.
Additionally, the present invention relates to a method of electroplating material on a substrate. The method includes providing an electroplating system such as described above. At least one substrate is introduced into the plating tank. Current is supplied to the at least one substrate to result in the plating of at least one metal contained within the plating solution onto at least a portion of the substrate.
Still other objects and advantages of the present invention will become readily apparent by those skilled in the art from the following detailed description, wherein it is shown and described only the preferred embodiments of the invention, simply by way of illustration of the best mode contemplated of carrying out the invention. As will be realized, the invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, without departing from the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
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Andricacos Panayotis C.
Dukovic John Owen
Uzoh Cyprian E.
Westerfield, Jr. Robert P.
Connolly Bove & Lodge & Hutz LLP
Gorgos Kathryn
International Business Machines - Corporation
Keehan Christopher M
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