Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1994-04-05
1997-02-18
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 18, B44C 122
Patent
active
056038470
ABSTRACT:
A circuit component assembly and a method for forming the assembly as an annular body in a laminate, preferably between a trough-hole or via and a surrounding conductive layer in a PCB are disclosed, the circuit component assembly including one or more resistors/conductors, inductors and dielectrics/capacitors or combinations thereof, outer and inner peripheries of the circuit component preferably having substantially constant radii permitting simple determination of operative electrical characteristics for the circuit component from (a) the inner and outer radii, (b) an effective thickness for the circuit component and (c) its electrical characteristics determined by the material formed in the annular recess, the circuit component body preferably being formed from a liquid precursor forming conductive interconnections for the circuit component assembly at its outer and inner perimeters.
REFERENCES:
patent: 2811621 (1957-10-01), Mucher et al.
patent: 3554877 (1971-01-01), Geisler
patent: 3582842 (1971-06-01), Friedman
patent: 4045636 (1977-08-01), Yoder et al.
patent: 4130857 (1978-12-01), Brower
patent: 4404059 (1983-09-01), Livshirts et al.
patent: 4735676 (1988-04-01), Iwasa
patent: 4808967 (1989-02-01), Rice et al.
patent: 4825536 (1989-05-01), Itemadami et al.
patent: 4870746 (1989-10-01), Klaser
patent: 4888574 (1989-12-01), Rice et al.
patent: 4892776 (1990-01-01), Rice
patent: 4911796 (1990-03-01), Reed
patent: 4964948 (1990-10-01), Reed
patent: 5039570 (1991-08-01), Sturm
patent: 5100695 (1992-03-01), Kawakami et al.
Biunno Nicholas
Bryan Scott K.
Choe Jin S.
Howard James R.
Lucas Gregory L.
Hill Robert Charles
Powell William
Zycon Corporation
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