Metal treatment – Process of modifying or maintaining internal physical... – Producing or treating layered – bonded – welded – or...
Reexamination Certificate
2004-11-29
2008-10-28
Wyszomierski, George (Department: 1793)
Metal treatment
Process of modifying or maintaining internal physical...
Producing or treating layered, bonded, welded, or...
C148S678000
Reexamination Certificate
active
07442267
ABSTRACT:
A ruthenium-containing thin film is formed. Typically, the ruthenium-containing thin film has a thickness in a range of about from 1 nm to 20 nm. The ruthenium-containing thin film is annealed in an oxygen-free atmosphere, for example, in N2forming gas, at a temperature in a range of about from 100° C. to 500° C. for a total time duration of about from 10 seconds to 1000 seconds. Thereafter, copper or other metal is deposited by electroplating or electroless plating onto the annealed ruthenium-containing thin film. In some embodiments, the ruthenium-containing thin film is also treated by UV radiation.
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Kwon, Oh-Kyum et al., “Enhancement of Iodine Adsorption Using I2 Plasma for Seedless Catalyst-Enhanced CVD of Copper”, Electrochemical and Solid-State Letters, vol. 6, No. 8, pp. C109-C111 (2003), The Electrochemical Society, Inc.
Park Se-yang
Reid Jonathan D.
Sukamto Johanes H.
Webb Eric G.
Novellus Systems Inc.
Swenson Thomas
Wyszomierski George
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