Anisotropically electroconductive adhesive and adhesively bonded

Details Anisotropically electroconductive adhesive and adhesively bonded Anisotropically electroconductive adhesive and adhesively bonded

1991-10-01

1993-02-02

Tolin, Gerald P.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

1562739, 252512, 361412, H05K 114

Patent

active

051839695

ABSTRACT:
A device is proposed to detect firm and reliable adhesive bonding and electrical connection between electrode arrays on two circuit boards by sandwiching a layer of an anisotropically electroconductive adhesive composition, in which the adhesive composition is formulated with an epoxy resin capable of changing color by complete curing and at least one of the circuit boards is prepared of a substrate having an opening or made from a transparent material in the vicinity of the electrode array so as to facilitate visual see-through inspection of the adhesive layer to detect complete curing of the adhesive composition.

REFERENCES:
patent: 3995964 (1976-12-01), De Groef
patent: 4780371 (1988-10-01), Joseph
patent: 4999460 (1991-03-01), Sugiyama
patent: 5001302 (1991-03-01), Atsumi
patent: 5065505 (1991-11-01), Matsubara

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