Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1998-10-21
1999-10-12
Kopec, Mark
Compositions
Electrically conductive or emissive compositions
Free metal containing
252514, 252513, 2525193, 428407, 428220, 428283, 174259, H01B 102, H01B 122, B32B 500
Patent
active
059650648
ABSTRACT:
An anisotropically electroconductive adhesive to be used for establishing electric connection between terminals of, for example, an IC chip and of a circuit pattern, at a low cost with high reliabilities both in the establishment of electric connection and in the insulation upon the connection without suffering from short-circuiting between circuit lines in the circuit and without causing any obstruction on the circuit, even when the terminals or the circuit lines are disposed at close intervals, which adhesive comprises an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.
REFERENCES:
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5225966 (1993-07-01), Basavanhally et al.
Saito Masao
Shinozaki Junji
Takeichi Motohide
Yamada Yukio
Hamlin Derrick G.
Kopec Mark
Sony Chemicals Corporation
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