Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1986-09-05
1988-04-12
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
264 24, 428900, H01R 909
Patent
active
047371129
ABSTRACT:
Electrical interconnection is established by means of an anisotropically conductive, composite layer medium comprising electrically conductive particles in a nonconductive matrix material. Enhanced uniformity of conductivity across the medium, and minimized incidence of lateral shorting are achieved as a result of essentially uniform distribution of electrically conductive particles which are also magnetic, such distribution resulting upon application of a magnetic field essentially perpendicular to a layer before or during hardening of the matrix material.
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"Investigation of Electrically Conducting Anisotropic Structures in Polymer Materials", V. E. Gul' and M. G. Golubeva, Kolloidnvi Zhurnal, vol. 30, No. 1, pp. 13-18, Jan.-Feb., 1968.
Jin Sung-ho
Mottine, Jr. John J.
Seger, Jr. Stephen G.
Sherwood Richard C.
Tiefel Thomas H.
Abrams Neil
American Telephone and Telegraph Company AT&T Bell Laboratories
Businger Peter A.
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