Anisotropically conductive adhesive composition

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156298, 156300, 156276, 174 685, 174 88R, 174 94R, 174 98, 200265, 252511, 252512, 252513, 252514, 252518, 338 13, 338 47, 338 72, 338 99, 338114, 338220, 339 17R, 339 17A, 339 17M, 339 18C, 339 59M, 339 61M, 339DIG3, 357 65, 357 80, 428323, 428328, 428901, B29C 6502, B29C 6554, B32B 516, B32B 712

Patent

active

047298090

ABSTRACT:
An anisotropically conductive adhesive composition (10) for use in electrically connecting at least one conductive area (14) on one substrate (12) with at least one conductive area (20) on a second substrate (18) is disclosed. The composition (10) is comprised of a mixture of conductive particles and a nonconductive adhesive binder (26). The conductive particles are dispersed throughout the binder in a plurality of noncontiguous conductive units (24) such that, upon applying a layer (30) of the composition (10) over both the conductive and insulating areas (14, 16) on one substrate (12) and positioning in a conducting relationship and adhering said at least one conductive area (20) on the second substrate (18) with said at least one conductive area (14) on the first substrate (12), the units (24) establish electrical connection between the adhered conductive areas (14, 20) on the two substrates (12, 18). The units (24) are sufficiently spaced apart, however, to preclude electrical conductivity between adjacent areas on the same substrate. A method for electrically connecting conductive areas on two substrates by means of said anisotropically conductive adhesive composition (10) and products produced by said method are also disclosed.

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