Anisotropically conducting adhesive

Details Anisotropically conducting adhesive Anisotropically conducting adhesive

1996-07-18

1999-04-06

Kopec, Mark

Compositions

Electrically conductive or emissive compositions

Free metal containing

252500, 252514, 156 47, 1563063, H01B 120, H01B 122, C09J 500, C09J 902

Patent

active

058913653

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

1. Field of the Invention
The invention concerns an anisotropically conducting adhesive in accordance with the preamble to claim 1.
2. Description of the related Art
Anisotropically conducting adhesives are known. These show finely dispersed conductive particles in a base material, for example in a thermoplastic material. The conductive particles there are dispersed as a granular powder in the base material. The anisotropically conductive adhesives, for example, exist in the shape of a foil and are suitable for bonding together two contacts to be electrically conductive, for example two strip conductors. Under the effects of pressure and temperature, the strip conductors are pressed onto opposite sides of the conductive adhesive so that the base material deforms and the electrically conductive particles dispersed in this material create an electrically conductive connection between the applied strip conductors. The base material here functions as an adhesive for the strip conductors.
It becomes clear that the resolution of the anisotropically conductive adhesive, that is the minimal possible space between two neighboring electrically conductive connections, depends on the composition of the dispersed electrically conductive particles. So that these particles permit an electrically conductive connection in one direction only, they must be at a sufficient distance from each other so that an undesired electrically conductive connection between the particles themselves is avoided. However, one disadvantage is that coagulation occurs during the dispersion of the conductive particles in the base material, meaning the lumping together of a majority of these electrically conductive particles. Because of that, the known anisotropically conductive adhesives can be used only to connect strip conductors or similar devices that are arranged relatively far from each other because otherwise a sufficient contact safety is not ensured.


SUMMARY OF THE INVENTION

The anisotropically conductive adhesive according to the invention, on the other hand, has the advantage that an even dispersion of the conductive particles in the base material is possible. The invention provides an anisotropically conducting adhesive with conductive particles that are dispersed in a base material, characterized in that these particles (14) exhibit as separating agents ligands on their surface which decompose during an adhesion process. The invention additionally provides a method for producing a bonded, electrically conductive connection between strip connectors, characterized in that the strip connectors are put on opposite surfaces of a adhesive, in accordance with one of the Patent claims 1 to 7, that pressure is applied to the adhesive and the strip connectors and that the ligands in the adhesive are decomposed. A coagulation of these particles is avoided due to the fact that the surfaces of these conductive particles are provided with separating agents. Thus, these particles are dispersed evenly in the base material without being electrically connected with each other. This has the advantage that the minimum space between two neighboring contact connections is actually determined only by a granule size of the electrically conductive particles. The anisotropism of this contact connection is ensured here with a high degree of certainty.
The preferred embodiment of the invention provides for the separating agents to consist of a coating of ligands which, preferably, are thermally unstable. This provides that in an unprocessed conductive adhesive, the electrically conductive particles are kept at a distance by the ligands. Because the ligands are thermally unstable, they are decomposed during the adherence and contacting process and thus cannot impede the forming of an electrically conductive connection. The destruction of the ligands occurs only at a point in time during the adherence and contacting process when the electrically conductive particles are already under a certain pressure so that these can no longer c

REFERENCES:
patent: 4735847 (1988-04-01), Fujiwana et al.
patent: 4999460 (1991-03-01), Sugiyama et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5376403 (1994-12-01), Capote et al.

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