Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1996-02-12
1997-06-10
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 91, H01R 909
Patent
active
056369964
ABSTRACT:
An anisotropic interposer pad (10) disposed between a first surface (11) and a second surface (12) in an electrical interface wherein the interface surfaces (11, 12) are non-compatible metals. The interposer pad (10) is a plastic layer (20) and a plurality of spaced-apart electrically conducting particles (21) are disposed in a random pattern throughout the plastic layer (20). The particles (21) extend between the first side (22) of the plastic layer (20) and the second side (23) of the plastic layer (20). There is no lateral contact between any of the particles (21). The particles (21) are electrically conductive in a direction oriented between the first side (22) and the second side (23) of the plastic layer (20). The particles (21) act as an electrical connection between the first surface (11) and the second surface (12).
REFERENCES:
patent: 3320658 (1967-05-01), Bolda et al.
patent: 3541222 (1970-11-01), Parks et al.
patent: 3967162 (1976-06-01), Ceresa et al.
patent: 4664309 (1987-05-01), Allen et al.
patent: 4737112 (1988-04-01), Jin et al.
Bates Warren A.
Brooks Charles P.
Deak Frederick R.
Johnson David C.
Volz Keith L.
Abrams Neil
The Whitaker Corporation
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