Anisotropic interconnect methodology for cost effective manufact

Details Anisotropic interconnect methodology for cost effective manufact Anisotropic interconnect methodology for cost effective manufact

1994-01-04

1995-10-10

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

174265, 228 563, 29884, H01K 310

Patent

active

054560047

ABSTRACT:
An interconnect sheet for connecting multiple layers of a circuit board for the manufacture of high interconnect density PWBs. The interconnect sheet preferably comprises an area array grid of 0.003 inch solder columns having a 0.006 inch pitch. The interconnect sheet is preferably used to attach two or more multi-layer boards by placing one sheet at every interconnect surface. This interconnect mechanism has an advantage of redundancy of contact and therefore lower susceptibility to failure than other methods. The interconnect sheet of the present invention also offers a large tolerance for registration error without shorting adjacent pads. The preferred method of fabrication of the interconnect sheet begins with creating equally spaced holes through a 0.5 ounce double sided laminate comprising a dielectric sheet and copper plates on either side of the dielectric. These holes are filled with solder paste and the sheet undergoes a baking process to shrink the paste. The remaining copper is then etched away using an alkaline etcher. The solder essentially acts as its own etch resist and thus remains. The solder is then reflowed causing it to ball, thus forming an interconnect sheet comprising a dielectric with a plurality of solder balls arranged throughout the dielectric.

REFERENCES:
patent: 4394712 (1983-07-01), Anthony
patent: 5229549 (1993-07-01), Yamakawa et al.
Anthony, T. R. "Forming Electrical Interconnections Through Semiconductor Wafers", J. Appl. Phys 52(8) Aug. 1981, pp. 5340-5349.

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