Electrical connectors – Including elastomeric or nonmetallic conductive portion
Reexamination Certificate
2006-11-07
2006-11-07
Hammond, Briggitte R. (Department: 2833)
Electrical connectors
Including elastomeric or nonmetallic conductive portion
C439S091000
Reexamination Certificate
active
07131851
ABSTRACT:
Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them. The conductive particles are obtained by coating core particles exhibiting magnetism with a high-conductive metal, a proportion of the high-conductive metal to the core particles is at least 15% by mass, and the following t is at least 50 nm: t=[1/(Sw·ρ)]×[N/(1−N)], wherein Sw is a BET specific surface area (m2/kg) of the core particles, ρ is a specific gravity (kg/m3) of the high-conductive metal, and N is (mass of the high-conductive metal/total mass of the conductive particles).
REFERENCES:
patent: 5586892 (1996-12-01), Sato
patent: 6802720 (2004-10-01), Weiss et al.
patent: 2001/0030019 (2001-10-01), Saitoh
patent: 2005/0272282 (2005-12-01), Setaka et al.
patent: 2002-203879 (2002-07-01), None
patent: 02/47149 (2002-06-01), None
U.S. Appl. No. 10/552,995, filed Oct. 13, 2005, Sato et al.
U.S. Appl. No. 10/560,347, filed Dec. 12, 2005, Yamada et al.
U.S. Appl. No. 10/548,832, filed Sep. 13, 2005, Igarashi et al.
U.S. Appl. No. 11/205,174, filed Aug. 17, 2005, Kokubo et al.
U.S. Appl. No. 10/522,536, filed Jan. 27, 2005, Setaka et al.
Hara Takeo
Kokubo Terukazu
Seno Koji
Setaka Ryoji
Hammond Briggitte R.
JSR Corporation
LandOfFree
Anisotropic conductivity connector, conductive paste... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Anisotropic conductivity connector, conductive paste..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Anisotropic conductivity connector, conductive paste... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3705269