Anisotropic conductive sheet and wafer inspection device

Details Anisotropic conductive sheet and wafer inspection device Anisotropic conductive sheet and wafer inspection device

2005-03-22

2005-03-22

Le, N. (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090, C439S068000

Reexamination Certificate

active

06870385

ABSTRACT:
Disclosed herein are a wafer inspection apparatus which is small in size, prevented from shortening the service life of its circuit board for inspection, can collectively perform inspection as to a great number of electrodes to be inspected, has good electrical properties and can perform electrical inspection of high functional integrated circuits, and an anisotropically conductive sheet suitable for use in this wafer inspection apparatus. The anisotropically conductive sheet is composed of an insulating sheet body, in which a through-hole has been formed, and an elastic anisotropically conductive film arranged in the through-hole. The insulating sheet body is formed of a material having a modulus of elasticity of 1×108to 1×1010Pa, a coefficient of linear thermal expansion of 3×10−6to 3×10−5K−1and a saturation magnetization lower than 0.1 wb/m2, the elastic anisotropically conductive film is composed of a plurality of conductive path-forming portions and insulating portions formed among these conductive path-forming portions, the conductive path-forming portions are obtained by filling conductive particles having a number average particle diameter of 30 to 150 μm, a coating layer composed of a noble metal and having a thickness of at least 20 nm is formed on surfaces of the conductive particles, each of the conductive path-forming portions has a durometer hardness of 15 to 45, and an electric resistance between conductive path-forming portions is at least 10 MΩ.

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