Anisotropic conductive material and method for connecting integr

Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Particulate matter

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428328, 428356, 42840224, 437 8, 437209, 437211, B32B 516, B32B 712

Patent

active

053024567

ABSTRACT:
An anisotropic conductive material includes micro-capsules dispersed in a bonding resin. The micro-capsules contains, as a filler material, a conductor and a polymerization initiator, a curing agent or a curing promotor. A wall member encapsulating the filler material is formed of a thermoplastic or thermosetting insulative resin. Therefore, if the micro-capsules in the anisotropic conductive material are broken or destroyed by pressure or both of pressure and heat, electrical connection can be established between electrode pads and electrode terminals of a wiring substrate through the conductors contained in the micro-capsules. Simultaneously, the polymerization initiator, the curing agent or the curing promotor flows out, so that the insulative bonding resin is solidified. Thus, the anisotropic conductive material has a high connection reliability, a good reproducibility, an excellent packaging workability, and excellent shelf stability.

REFERENCES:
patent: 4735847 (1988-04-01), Fujiwara et al.
patent: 5120665 (1992-06-01), Tsukagoshi et al.

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