Anisotropic conductive film and method for producing the same

Details Anisotropic conductive film and method for producing the same Anisotropic conductive film and method for producing the same

2008-06-24

2008-06-24

Kopec, Mark (Department: 1796)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S513000, C252S514000

Reexamination Certificate

active

07390442

ABSTRACT:
An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 μm-20 μm when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

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