Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1992-11-03
1994-07-19
Lieberman, Paul
Compositions
Electrically conductive or emissive compositions
Free metal containing
252514, 252518, 525403, 525438, H01B 100, H01B 120, H01B 122
Patent
active
053306848
ABSTRACT:
A composition for forming a moisture resistant, anisotropic conductive film having a rapid curing speed, high heat resistance, high humidity resistance, long shelf life and excellent repairability comprising an adhesive composition containing about 100 parts cyanate ester, from about 0.01 part to 10 parts of a curing catalyst, from about 10 parts to about 300 parts of a film-formable thermoplastic resin, and from about 10 to about 500 parts of an epoxy resin, and from about 0.1 part to about 20 parts conductive particles per 100 parts total adhesive composition.
REFERENCES:
patent: 3562214 (1971-02-01), Kubens et al.
patent: 4552690 (1985-11-01), Ikeguchi et al.
patent: 4740343 (1988-04-01), Gaku et al.
patent: 4780507 (1988-10-01), Gaku et al.
patent: 5143785 (1992-09-01), Pujol et al.
Emori Kenji
Tasaka Yoshihiko
Griswold Gary L.
Kirn Walter N.
Kopec M.
Lieberman Paul
Minnesota Mining and Manufacturing Company
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