Anisotropic conductive adhesive, electrode connection...

Details Anisotropic conductive adhesive, electrode connection... Anisotropic conductive adhesive, electrode connection...

2006-01-23

2009-12-22

Luu, Chuong A. (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Non-single crystal, or recrystallized, semiconductor...

Amorphous semiconductor material

C257S072000, C257S013000, C257S079000

Reexamination Certificate

active

07635862

ABSTRACT:
Anisotropic conductive adhesive has conductive particles dispersed in adhesive and includes hard particles having conductivity, a resin layer that coats the hard particles and a conductive layer that coats the resin layer. A connection structure electrically connects electrodes to each other with the anisotropic conductive adhesive. A connection method includes the steps of causing the anisotropic conductive to intervene between electrodes, applying pressure to the anisotropic conductive adhesive and allowing the adhesive to be solidified.

REFERENCES:
patent: 5001302 (1991-03-01), Atsumi
patent: 6981317 (2006-01-01), Nishida
patent: 10-274778 (1998-10-01), None
patent: 2003-272445 (2003-09-01), None

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