Anisotropic conductive adhesive compositions

Details Anisotropic conductive adhesive compositions Anisotropic conductive adhesive compositions

1996-12-16

1998-11-24

Kopec, Mark

Compositions

Electrically conductive or emissive compositions

252512, 252514, 156 60, 156 94, 156247, 156327, H01B 122, B32B 3500, B32B 3100

Patent

active

058402152

ABSTRACT:
A novel thermally reworkable anisotropic conductive adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises

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Search Report dated 17/Apr./1998.
"Cleavable Epoxy Resins: Design for Disassembly of a Thermoset," by S. L. Buchwalter and L.L. Kosbar, Journal of PolymerScience: Part A: Polymer Chemistry, vol. 34, pp. 249-260 (1996). (No Month).

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