Compositions – Electrically conductive or emissive compositions – Elemental carbon containing
Patent
1999-03-16
2000-03-21
Kopec, Mark
Compositions
Electrically conductive or emissive compositions
Elemental carbon containing
252512, 252513, 349122, D14100, 361683, H01B 106
Patent
active
060398965
ABSTRACT:
An anisotropic conductive adhesive contains conductive particles dispersed in a resin composition, wherein the resin composition includes a radical polymerization resin (A), an organic peroxide (B), a thermoplastic elastomer (C) and a phosphoric ester (D). The resin composition can further contain an epoxy silane coupling agent (E) represented by formula (2) or (3). The resin composition is mixed with other components after the radical polymerization resin (A), the thermoplastic elastomer (C), the phosphoric ester (D) and the epoxy silane coupling agent (E) are reacted. It is also possible to preliminarily react only the phosphoric ester (D) and the epoxy silane coupling agent (E) and to react the product of the preliminary reaction with the radical polymerization resin (A) and the thermoplastic elastomer (C), and then to add other components. The anisotropic conductive adhesive of the present invention can be used for electrical joining of electronic or electric parts of electrical apparatus.
REFERENCES:
patent: 4777204 (1988-10-01), Ikenaga et al.
patent: 5403873 (1995-04-01), Nakamura et al.
patent: 5486580 (1996-01-01), Newsham et al.
Patent Abstract of Japan, Publication No. 10-140116 A, Publication Date May 26, 1998.
Patent Abstract of Japan, Publication No. 10-183098 A, Publication Date Jul. 7, 1998.
Kawata Masakazu
Miyamoto Tetsuya
Hamlin Derrick G.
Kopec Mark
Sumitomo Bakelite Co. Ltd.
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