Anisotropic conductive adhesive

Details Anisotropic conductive adhesive Anisotropic conductive adhesive

2006-09-26

2010-06-15

Pyon, Harold Y (Department: 1796)

Compositions

Electrically conductive or emissive compositions

C252S502000, C252S511000, C252S512000, C252S513000, C252S514000, C252S518100, C428S343000, C428S413000

Reexamination Certificate

active

07736541

ABSTRACT:
An anisotropic conductive adhesive is provided that includes an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler, and conducting particles as components. The phenoxy resin is controlled to have a glass-transition temperature (Tg) in a range of 66° C. to 100° C., so that the anisotropic conductive adhesive has an excellent fluidity in a mounting process, satisfactory electric conductive/insulation performances, and sufficient adhesiveness. Since the properties of the anisotropic conductive adhesive are almost invariant even if the adhesive is used for a long time under a high-temperature- and high-humidity condition, the anisotropic conductive adhesive can be used for applications where a high reliability is required.

REFERENCES:
patent: 6452111 (2002-09-01), Kumakura
patent: 6780898 (2004-08-01), Kumakura
patent: 7247381 (2007-07-01), Watanabe et al.
patent: 2003/0141014 (2003-07-01), Satoyuki et al.
patent: 2006/0113511 (2006-06-01), Chen
patent: 2007/0054114 (2007-03-01), Kumakura
patent: 2007/0055039 (2007-03-01), Usui et al.
patent: 2007/0175579 (2007-08-01), Otani et al.
patent: 2007/0212521 (2007-09-01), Bessho et al.
patent: 2007/0215838 (2007-09-01), Toshioka et al.
patent: 1 628 363 (2006-02-01), None
patent: 07-216329 (1995-08-01), None
patent: 08-315885 (1996-11-01), None
patent: 2000-204324 (2000-07-01), None
patent: 2002-201450 (2002-04-01), None
patent: 2002-201449 (2002-07-01), None
patent: 2002-203871 (2002-07-01), None
patent: 2002-204052 (2002-07-01), None
patent: 2003-253231 (2003-09-01), None
patent: 2004-220916 (2004-08-01), None
patent: 2004-331728 (2004-11-01), None
patent: 2005-290241 (2005-10-01), None
patent: WO 2005/023954 (2005-03-01), None
patent: WO2005026279 (2005-03-01), None
patent: WO 2006/064678 (2006-06-01), None
Database WPI Week 200524, Thomson Scientific, London, GB; AN 2005-233276; XP002560345.
European Search Report issued in European Patent Application No. EP 06 81 0552.7 dated Dec. 28, 2009.

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