Anisotropic conductive adhesive

Details Anisotropic conductive adhesive Anisotropic conductive adhesive

2004-10-05

2008-11-18

McClendon, Sanza L (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C522S096000, C522S100000, C522S102000, C522S103000, C522S104000, C522S106000, C522S107000, C522S150000, C522S152000, C522S153000, C522S154000, C522S157000, C522S158000, C522S159000, C522S160000, C522S161000, C522S109000, C522S110000, C522S111000, C522S112000, C522S071000, C522S081000, C252S500000, C252S510000, C252S511000

Reexamination Certificate

active

07452923

ABSTRACT:
The present invention discloses an anisotropic conductive adhesive comprising an insulating adhesive component and a number of conductive particles dispersed in the insulating adhesive component, wherein the insulating adhesive component contains a crosslinked rubber resin. The anisotropic conductive adhesive of the present invention prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing its the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, whereby a short circuit between adjacent electrodes can be prevented when connecting the circuits, and excellent connection reliability according to a long-term use is achieved.

REFERENCES:
patent: 6140396 (2000-10-01), Sugioka et al.
patent: 6592783 (2003-07-01), Kumakura et al.
patent: 2003/0102466 (2003-06-01), Kumakura et al.
patent: 2006/0054277 (2006-03-01), Byun et al.
patent: 62-141083 (1987-06-01), None
patent: 10-147762 (1998-06-01), None
patent: 11-329069 (1999-11-01), None

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