Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Reexamination Certificate
2006-05-09
2006-05-09
Sellers, Robert (Department: 1712)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
C438S127000
Reexamination Certificate
active
07041736
ABSTRACT:
An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
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Machine Translation, JP 2001-139669, Inomata et al., May 22, 2001.
Derwent accession No. 2002-173912 for Japanese Patent No. 2001-139669, JSR Corporation, May 22, 2001.
CAPLUS accession No. 2001:372184 for Japanese Patent No. 2001-139669, JSR Co., Ltd., May 22, 2001.
Jayaraman Saikumar
Manepalli Rahul
Intel Corporation
Kenyon & Kenyon LLP
Sellers Robert
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